an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. advance information for pre-production products; subject to change without notice. DLPC3434 dlps145 ? july 2018 DLPC3434 datasheet 1 1 features 1 ? dlp230kp (.23 hd) dmd display controller ? supports input resolutions up to 720p ? low-power dmd interface with interface training ? input frame rates up to 120 hz (60 hz at 720p resolution) ? 24-bit, input pixel interface including: ? parallel interface protocol ? pixel clock up to 150 mhz ? multiple input pixel data format options ? pixel data processing including: ? intellibright ? suite of image processing algorithms ? content adaptive illumination control ? local area brightness boost ? color coordinate adjustment ? active power management processing ? external flash support ? embedded frame memory (edram) ? system features including: ? i 2 c control of device configuration ? programmable led current control ? one frame latency 2 applications ? smart phone, tablet, laptop ? battery-powered mobile accessory ? wearable (near-eye) display ? smart home display ? smart speaker 3 description the DLPC3434 digital controller, part of the dlp230kp (.23 720p) chipset, supports reliable operation of the dlp230kp digital micromirror device (dmd). the dlp230kp chipset enables small form factor, low power, and high resolution hd displays. visit the getting started with ti dlp ? pico tm display technology page to learn how to get started with the dlp230kp chipset. the dlp230kp chipset includes established resources to help the user accelerate the design cycle, which include production ready optical modules , optical modules manufactures , and design houses . device information (1) part number package body size (nom) DLPC3434 nfbga (176) 7.00 mm x 7.00 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. simplified schematic advance information tools & software technical documents ordernow productfolder support &community
2 DLPC3434 dlps145 ? july 2018 www.ti.com product folder links: DLPC3434 submit documentation feedback copyright ? 2018, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 device and documentation support .................... 3 5.1 device support ........................................................ 3 5.2 related links ............................................................ 5 5.3 community resources .............................................. 5 5.4 trademarks ............................................................... 5 5.5 electrostatic discharge caution ................................ 5 5.6 glossary .................................................................... 5 6 mechanical, packaging, and orderable information ............................................................. 5 6.1 package option addendum ...................................... 6 4 revision history date revision notes * initial release. advance information
3 DLPC3434 www.ti.com dlps145 ? july 2018 product folder links: DLPC3434 submit documentation feedback copyright ? 2018, texas instruments incorporated 5 device and documentation support 5.1 device support 5.1.1 third-party products disclaimer ti's publication of information regarding third-party products or services does not constitute an endorsement regarding the suitability of such products or services or a warranty, representation or endorsement of such products or services, either alone or in combination with any ti product or service. 5.1.2 device nomenclature 5.1.2.1 device markings marking definitions: line 1: dlp ? device name: dlpc343x where x is a "4" for this device. sc: solder ball composition e1: indicates lead-free solder balls consisting of snagcu g8: indicates lead-free solder balls consisting of tin-silver-copper (snagcu) with silver content less than or equal to 1.5% and that the mold compound meets ti's definition of green. line 2: ti part number dlp ? device name: dlpc343x = x is a "4" for this device. r corresponds to the ti device revision letter for example a, b or c xxx corresponds to the device package designator. line 3: xxxxxxxxxx-tt manufacturer part number line 4: llllll.zzz foundry lot code for semiconductor wafers llllll: fab lot number zzz: lot split number line 5: ph yyww es : package assembly information ph: manufacturing site yyww: date code (yy = year :: ww = week) advance information terminal a1 corner identifier 1 2 3 4 5 dlpc343xrxxx xxxxxxxxxx-tt llllll.zzz ph yyww dlpc343x sc
4 DLPC3434 dlps145 ? july 2018 www.ti.com product folder links: DLPC3434 submit documentation feedback copyright ? 2018, texas instruments incorporated device support (continued) note 1. engineering prototype samples are marked with an x suffix appended to the ti part number. for example, 2512737-0001x. 5.1.3 video timing parameter definitions active lines per frame (alpf) defines the number of lines in a frame containing displayable data: alpf is a subset of the tlpf. active pixels per line (appl) defines the number of pixel clocks in a line containing displayable data: appl is a subset of the tppl. horizontal back porch (hbp) blanking number of blank pixel clocks after horizontal sync but before the first active pixel. note: hbp times are reference to the leading (active) edge of the respective sync signal. horizontal front porch (hfp) blanking number of blank pixel clocks after the last active pixel but before horizontal sync. horizontal sync (hs) timing reference point that defines the start of each horizontal interval (line). the absolute reference point is defined by the active edge of the hs signal. the active edge (either rising or falling edge as defined by the source) is the reference from which all horizontal blanking parameters are measured. total lines per frame (tlpf) defines the vertical period (or frame time) in lines: tlpf = total number of lines per frame (active and inactive). total pixel per line (tppl) defines the horizontal line period in pixel clocks: tppl = total number of pixel clocks per line (active and inactive). vertical sync (vs) timing reference point that defines the start of the vertical interval (frame). the absolute reference point is defined by the active edge of the vs signal. the active edge (either rising or falling edge as defined by the source) is the reference from which all vertical blanking parameters are measured. vertical back porch (vbp) blanking number of blank lines after the leading edge of vertical sync but before the first active line. vertical front porch (vfp) blanking number of blank lines after the last active line but before the leading edge of vertical sync. figure 1. timing parameter diagram advance information vertical back porch (vbp) vertical front porch (vfp) horizontal back porch (hbp) horizontal front porch (hfp) tlpf tppl appl alpf
5 DLPC3434 www.ti.com dlps145 ? july 2018 product folder links: DLPC3434 submit documentation feedback copyright ? 2018, texas instruments incorporated 5.2 related links the table below lists quick access links. categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. table 1. related links parts product folder sample & buy technical documents tools & software support & community DLPC3434 click here click here click here click here click here dlp230kp click here click here click here click here click here dlpa3000 click here click here click here click here click here 5.3 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 5.4 trademarks intellibright, e2e are trademarks of texas instruments. all other trademarks are the property of their respective owners. 5.5 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 5.6 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 6 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. advance information
DLPC3434 dlps145 ? july 2018 www.ti.com 6 product folder links: DLPC3434 submit documentation feedback copyright ? 2018, texas instruments incorporated (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. pre_prod unannounced device, not in production, not available for mass market, nor on the web, samples not available. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. space (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti ' s terms " lead-free " or " pb-free " mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br) : ti defines " green " to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) space (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. space (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space (5) multiple device markings will be inside parentheses. only on device marking contained in parentheses and separated by a " ~ " will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. important information and disclaimer: the information provided on this page represents ti ' s knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti ' s liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. 6.1 package option addendum 6.1.1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp ( c) device marking (4) (5) dlpc3437czez active nfbga zez 201 160 tbd call ti level-3-260c-168 hrs ? 30 to 85 c advance information
package option addendum www.ti.com 14-jul-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples xDLPC3434czvb active nfbga zvb 176 260 tbd call ti call ti (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
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